John W Balde
Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging John W Balde Softcover reprint of the original 1st ed. 2003 edition

Name: Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging
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Author: John W Balde

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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging

John W Balde

Softcover reprint of the original 1st ed. 2003 edition

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

366 pages, 266 black & white illustrations, biography

Mediji	Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists	2014. gada 23. februāris
ISBN13	9781461349778
Izdevēji	Springer-Verlag New York Inc.
Lapas	347
Izmēri	155 × 235 × 20 mm · 521 g
Valoda	Angļu
Redaktors	Balde, John W.