Pastāsti draugiem par šo preci:
Elements of Electromigration: Electromigration in 3D IC technology Tu, King-Ning (City University of Hong Kong)
Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning (City University of Hong Kong)
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2025. gada 25. decembris |
| ISBN13 | 9781032470283 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 132 |
| Izmēri | 150 × 220 × 10 mm · 260 g |
| Valoda | Angļu |