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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.
256 pages, 11 Tables, black and white; 123 Line drawings, black and white; 7 Halftones, black and wh
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2023. gada 22. decembris |
| ISBN13 | 9781032363813 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 212 |
| Izmēri | 150 × 220 × 20 mm · 489 g |
| Valoda | Angļu |
| Redaktors | Ajayan, J (SR UNIVERSITY, INDIA) |
| Redaktors | Bhattacharya, Sandip (SR UNIVERSITY, INDIA) |
| Redaktors | Herrera, Fernando Avila |
