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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2025. gada 26. jūnijs |
| ISBN13 | 9781032363820 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 212 |
| Izmēri | 150 × 220 × 10 mm · 360 g |
| Valoda | Angļu |
| Redaktors | Ajayan, J (SR UNIVERSITY, INDIA) |
| Redaktors | Bhattacharya, Sandip (SR UNIVERSITY, INDIA) |
| Redaktors | Herrera, Fernando Avila |
