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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging Lian-Tuu Yeh 2 Revised edition
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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging
Lian-Tuu Yeh
This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
500 pages, black & white illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2016. gada 1. jūnijs |
| ISBN13 | 9780791861097 |
| Izdevēji | American Society of Mechanical Engineers |
| Lapas | 500 |
| Izmēri | 152 × 229 × 29 mm · 866 g |
| Valoda | Angļu |
| Sērijas redaktors | Agonafer, D. |
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