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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018) Asme
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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)
Asme
A printed collection of 62 full-length, peer-reviewed technical papers. Topics include Heterogeneous Integration: Micro-Systems With Diverse Functionality; Servers of the Future, IoT, and Edge to Cloud; Structural and Physical Health Monitoring; Power Electronics, Energy Conversion, and Storage; and Autonomous, Hybrid, and Electric Vehicles.
558 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2019. gada 30. novembris |
| ISBN13 | 9780791851920 |
| Izdevēji | American Society of Mechanical Engineers |
| Lapas | 558 |
| Izmēri | 150 × 220 × 10 mm · 924 g (Svars (aptuveni)) |
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