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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly Jennie Hwang New edition
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Jennie Hwang
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
456 pages, 77 black & white illustrations, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 1992. gada 24. septembris |
| ISBN13 | 9780442013530 |
| Izdevēji | Van Nostrand Reinhold Inc.,U.S. |
| Lapas | 456 |
| Izmēri | 152 × 229 × 24 mm · 639 g |
| Valoda | Angļu |