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Manufacturing Challenges in Electronic Packaging Lee 1998 edition
Manufacturing Challenges in Electronic Packaging
Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1997. gada 31. decembris |
| ISBN13 | 9780412620300 |
| Izdevēji | Chapman and Hall |
| Lapas | 261 |
| Izmēri | 155 × 235 × 17 mm · 562 g |
| Valoda | Angļu |
| Redaktors | Chen, W.T. |
| Redaktors | Lee, Y.C. |
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