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Tin and Solder Plating in the Semiconductor Industry A.C. Tan 1993 edition
Tin and Solder Plating in the Semiconductor Industry
A.C. Tan
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
352 pages, black & white illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1992. gada 30. novembris |
| ISBN13 | 9780412482403 |
| Izdevēji | Chapman and Hall |
| Lapas | 326 |
| Izmēri | 210 × 297 × 20 mm · 666 g |
| Valoda | Angļu |