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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems Sung Kyu Lim 1. izdevums
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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems
Sung Kyu Lim
This book covers 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as
324 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2020. gada 30. septembris |
| ISBN13 | 9780367655921 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 324 |
| Izmēri | 232 × 156 × 27 mm · 496 g |
| Valoda | Angļu |
| Sērijas redaktors | Iniewski, Krzysztof (Redlen Technologies Inc., Canada.) |
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