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Area Array Packaging Processes Ken Gilleo
Area Array Packaging Processes
Ken Gilleo
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2003. gada 23. oktobris |
| ISBN13 | 9780071738019 |
| Izdevēji | McGraw-Hill |
| Lapas | 272 |
| Izmēri | 231 × 14 × 188 mm · 471 g |
| Valoda | Angļu |