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Fundamentals of Microsystems Packaging Rao Tummala Ed edition
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Fundamentals of Microsystems Packaging
Rao Tummala
Suitable for engineers, technicians, and students, this book teaches microsystems packaging. It covers the field from wafer to systems, including various major contributing technologies. It features a comprehensive tutorial covering various major aspects of microelectronics, photonics, RF, packaging design, assembly, reliability, and, testing.
967 pages, 150 Illustrations, unspecified
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2001. gada 29. maijs |
| ISBN13 | 9780071371698 |
| Izdevēji | McGraw-Hill Education - Europe |
| Lapas | 967 |
| Izmēri | 234 × 338 × 64 mm · 1,87 kg |
| Valoda | Angļu |
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