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System on Package Rao Tummala Ed edition
System on Package
Rao Tummala
"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.
785 pages, Illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2007. gada 1. aprīlis |
| Oriģinālā izdošanas datums | 2008 |
| ISBN13 | 9780071459068 |
| Izdevēji | McGraw-Hill Education - Europe |
| Lapas | 785 |
| Izmēri | 193 × 241 × 35 mm · 1,40 kg |
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