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Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation Yongle Wu 2023 edition
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Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation
Yongle Wu
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.
311 pages, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illu
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2023. gada 2. jūnijs |
| ISBN13 | 9789819914548 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 311 |
| Izmēri | 247 × 163 × 22 mm · 676 g |
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