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Thermoplasmonics: From Principles, Materials and Characterization to Engineering Applications Guohua Liu 2024 edition
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Thermoplasmonics: From Principles, Materials and Characterization to Engineering Applications
Guohua Liu
This book is built on the recent advancements in understanding thermoplasmonics and highlights the exciting new directions that are shaping this field.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2024. gada 22. novembris |
| ISBN13 | 9789819783311 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 181 |
| Izmēri | 150 × 220 × 20 mm · 457 g |