Swaminathan, Madhavan (Georgia Institute of Technology, USA)
Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging Swaminathan, Madhavan (Georgia Institute of Technology, USA)

Name: Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging
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Author: Swaminathan, Madhavan (Georgia Institute of Technology, USA)

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Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging

Swaminathan, Madhavan (Georgia Institute of Technology, USA)

380 pages

Mediji	Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku)
Izlaists	2013. gada 24. decembris
ISBN13	9789814508599
Izdevēji	World Scientific Publishing Co Pte Ltd
Lapas	380
Izmēri	236 × 156 × 26 mm · 672 g

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Swaminathan, Madhavan (Georgia Institute of Technology, USA) Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging Swaminathan, Madhavan (Georgia Institute of Technology, USA)

Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging

Swaminathan, Madhavan (Georgia Institute of Technology, USA)

Vairāk no tā paša izdevēja

Swaminathan, Madhavan (Georgia Institute of Technology, USA)
Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging Swaminathan, Madhavan (Georgia Institute of Technology, USA)