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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology Cher Ming Tan 2013 edition
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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2013. gada 4. maijs |
| ISBN13 | 9789814451208 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 103 |
| Izmēri | 155 × 235 × 6 mm · 1,88 kg |
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