Pastāsti draugiem par šo preci:
Electromigration In Ulsi Interconnections - International Series On Advances In Solid State Electronics And Technology Tan, Cher Ming (Ntu, S'pore)
Cena
€ 120,99
Pasūtīts no attālās noliktavas
Paredzamā piegāde . gada 31. aug. - . gada 14. sept.
Saņemiet paziņojumus par jauniem Tan, Cher Ming (Ntu, S'pore) izdevumiem
Mūsu klienti saka:
Pievienot savam iMusic vēlmju sarakstam
Electromigration In Ulsi Interconnections - International Series On Advances In Solid State Electronics And Technology
Tan, Cher Ming (Ntu, S'pore)
Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
312 pages, illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2010. gada 25. augusts |
| ISBN13 | 9789814273329 |
| Izdevēji | World Scientific Publishing Co Pte Ltd |
| Lapas | 312 |
| Izmēri | 155 × 229 × 23 mm · 589 g |
