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Solder Materials - Wspc Series in Advanced Integration and Packaging Lin, Kwang-Lung (National Cheng Kung University, Taiwan)
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Solder Materials - Wspc Series in Advanced Integration and Packaging
Lin, Kwang-Lung (National Cheng Kung University, Taiwan)
388 pages
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2018. gada 5. septembris |
| ISBN13 | 9789813237605 |
| Izdevēji | World Scientific Publishing Co Pte Ltd |
| Lapas | 388 |
| Izmēri | 161 × 236 × 27 mm · 712 g |
![Cover for Dash, Jan W (J Dash Consultants, LLC, USA) · Quantitative Finance, Climate Change, and Risk Management: a Physicist's Approach (Hardcover Book) [Third edition] (2027)](https://imusic.b-cdn.net/images/item/original/358/9789819821358.jpg?dash-jan-w-j-dash-consultants-llc-usa-2027-quantitative-finance-climate-change-and-risk-management-a-physicist-s-approach-hardcover-book&class=scaled&v=1779094136)
