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Advanced Liquid Metal Cooling for Chip, Device and System Liu, Jing (Tsinghua University, China)
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Advanced Liquid Metal Cooling for Chip, Device and System
Liu, Jing (Tsinghua University, China)
This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category - liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
660 pages
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2022. gada 11. maijs |
| ISBN13 | 9789811245855 |
| Izdevēji | World Scientific Publishing Co Pte Ltd |
| Lapas | 960 |
| Izmēri | 150 × 220 × 20 mm · 1,44 kg |
| Valoda | Angļu |
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