Pastāsti draugiem par šo preci:
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R Cheng 1st ed. 2018 edition
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R
Cheng
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.
| Mediji | Grāmatas Book |
| Izlaists | 2017. gada 18. septembris |
| ISBN13 | 9789811061646 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 137 |
| Izmēri | 150 × 220 × 20 mm · 354 g |
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim