Pastāsti draugiem par šo preci:
Electrical Design of Through Silicon Via Manho Lee 2014 edition
Electrical Design of Through Silicon Via
Manho Lee
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
289 pages, 249 black & white illustrations, 249 colour tables, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2014. gada 20. maijs |
| ISBN13 | 9789401790376 |
| Izdevēji | Springer |
| Lapas | 280 |
| Izmēri | 162 × 240 × 20 mm · 585 g |
| Redaktors | Kim, Joungho |
| Redaktors | Lee, Manho |
| Redaktors | Pak, Jun So |