Pastāsti draugiem par šo preci:
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses Qingke Zhang 1st ed. 2016 edition
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses
Qingke Zhang
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
143 pages, 81 black & white illustrations, 34 colour illustrations, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2015. gada 16. novembris |
| ISBN13 | 9783662488218 |
| Izdevēji | Springer-Verlag Berlin and Heidelberg Gm |
| Lapas | 143 |
| Izmēri | 155 × 235 × 15 mm · 389 g |
| Valoda | Vācu |
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim