Force Sensors for Microelectronic Packaging Applications - Microtechnology and MEMS - Jurg Schwizer - Grāmatas - Springer-Verlag Berlin and Heidelberg Gm - 9783642060632 - 2010. gada 22. oktobris
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Jurg Schwizer
Force Sensors for Microelectronic Packaging Applications - Microtechnology and MEMS Softcover reprint of hardcover 1st ed. 2005 edition

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Paredzamā piegāde . gada 29. jūl. - . gada 6. aug.
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Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

178 pages, biography

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2010. gada 22. oktobris
ISBN13 9783642060632
Izdevēji Springer-Verlag Berlin and Heidelberg Gm
Lapas 178
Izmēri 155 × 235 × 10 mm   ·   272 g
Valoda Angļu  

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