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Wafer Bonding: Applications and Technology - Springer Series in Materials Science Marin Alexe Softcover reprint of the original 1st ed. 2004 edition
Wafer Bonding: Applications and Technology - Springer Series in Materials Science
Marin Alexe
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.
519 pages, 363 black & white illustrations, 20 colour illustrations, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2011. gada 30. septembris |
| ISBN13 | 9783642059155 |
| Izdevēji | Springer-Verlag Berlin and Heidelberg Gm |
| Lapas | 504 |
| Izmēri | 155 × 235 × 27 mm · 725 g |
| Valoda | Vācu |
| Redaktors | Alexe, Marin |
| Redaktors | Goesele, Ulrich |