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Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science Michael R Oliver 2004 edition
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Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science
Michael R Oliver
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
428 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2004. gada 26. janvāris |
| ISBN13 | 9783540431817 |
| Izdevēji | Springer-Verlag Berlin and Heidelberg Gm |
| Lapas | 428 |
| Izmēri | 155 × 235 × 26 mm · 793 g |
| Valoda | Franču |
| Redaktors | Oliver, M.R. |
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