Pastāsti draugiem par šo preci:
Die Attach Materials for High Temperature Applications in Microelectronics Packa 1st ed. 2019 edition
Die Attach Materials for High Temperature Applications in Microelectronics Packa
276 pages, 100 Tables, color; 121 Illustrations, color; 54 Illustrations, black and white; XX, 276 p
| Mediji | Grāmatas Book |
| Izlaists | 2019. gada 7. februāris |
| ISBN13 | 9783319992556 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 279 |
| Izmēri | 242 × 167 × 19 mm · 623 g |
| Valoda | Vācu |
| Redaktors | Siow, Kim S. |