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Materials for Advanced Packaging Softcover reprint of the original 2nd ed. 2017 edition
Materials for Advanced Packaging
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2018. gada 8. jūnijs |
| ISBN13 | 9783319832098 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 969 |
| Izmēri | 234 × 157 × 55 mm · 1,49 kg |
| Valoda | Vācu |
| Redaktors | Lu, Daniel |
| Redaktors | Wong, C.P. |