3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics -  - Grāmatas - Springer International Publishing AG - 9783319830865 - 2018. gada 13. jūlijs
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.


463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2018. gada 13. jūlijs
ISBN13 9783319830865
Izdevēji Springer International Publishing AG
Lapas 463
Izmēri 150 × 220 × 10 mm   ·   662 g
Valoda Vācu  
Redaktors Goyal, Deepak
Redaktors Li, Yan

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