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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition
3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2018. gada 13. jūlijs |
| ISBN13 | 9783319830865 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 463 |
| Izmēri | 150 × 220 × 10 mm · 662 g |
| Valoda | Vācu |
| Redaktors | Goyal, Deepak |
| Redaktors | Li, Yan |