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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok 2018 edition
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
115 pages, 106 Illustrations, black and white; VIII, 115 p. 106 illus.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2018. gada 14. maijs |
| ISBN13 | 9783319778716 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 115 |
| Izmēri | 150 × 220 × 20 mm · 353 g |