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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems 1st ed. 2016 edition
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
339 pages, 81 black & white illustrations, 157 colour illustrations, 22 black & white tables, 193 co
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2016. gada 23. maijs |
| ISBN13 | 9783319204802 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 339 |
| Izmēri | 241 × 166 × 26 mm · 684 g |
| Valoda | Vācu |
| Redaktors | Elfadel, Ibrahim (Abe) M. |
| Redaktors | Fettweis, Gerhard |