High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering - Chulwoo Kim - Grāmatas - Springer International Publishing AG - 9783319023809 - 2013. gada 18. novembris
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Chulwoo Kim
High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition

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This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

112 pages, 50 black & white illustrations, 41 colour illustrations, 8 black & white tables, 1 colour

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2013. gada 18. novembris
ISBN13 9783319023809
Izdevēji Springer International Publishing AG
Lapas 112
Izmēri 155 × 235 × 5 mm   ·   149 g
Valoda Angļu  

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