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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Brandon Noia 2014 edition
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Brandon Noia
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.
274 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2013. gada 2. decembris |
| ISBN13 | 9783319023779 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 245 |
| Izmēri | 157 × 243 × 16 mm · 657 g |
| Valoda | Vācu |