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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness Josef Lutz Third Edition 2026 edition
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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness
Josef Lutz
This new edition of the book Semiconductor Power Devices is now divided into two volumes. Additional chapters discuss electromagnetic disturbances, oscillations, and the integration of power electronic systems, making this volume an essential resource for engineers and researchers working on robust and efficient power device design.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Tiks izlaists | 2026. gada 23. augusts |
| ISBN13 | 9783032234889 |
| Izdevēji | Springer Nature Switzerland AG |
| Lapas | 361 |
| Izmēri | 150 × 220 × 20 mm · 574 g (Svars (aptuveni)) |
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