Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications: Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3 - Lecture Notes in Electrical Engineering -  - Grāmatas - Springer Nature Switzerland AG - 9783032203175 - 2026. gada 27. marts
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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications: Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3 - Lecture Notes in Electrical Engineering

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This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025.

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2026. gada 27. marts
ISBN13 9783032203175
Izdevēji Springer Nature Switzerland AG
Lapas 567
Izmēri 166 × 240 × 37 mm   ·   1,03 kg
Valoda Vācu  
Redaktors Bhateja, Vikrant
Redaktors Omar, Zaid
Redaktors Pham, Hai Van
Redaktors Yang, Xin-She

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