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Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering Chong Leong Gan
Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering
Chong Leong Gan
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2025. gada 22. jūlijs |
| ISBN13 | 9783031947940 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 178 |
| Izmēri | 150 × 220 × 20 mm · 444 g |
| Valoda | Vācu |