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More-than-Moore Devices and Integration for Semiconductors 2023 edition
More-than-Moore Devices and Integration for Semiconductors
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources.
260 pages, XIV, 260 p.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2024. gada 18. februāris |
| ISBN13 | 9783031216121 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 260 |
| Izmēri | 150 × 220 × 10 mm · 423 g |
| Valoda | Vācu |
| Redaktors | Balestra, Francis |
| Redaktors | Iacopi, Francesca |