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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies Nabil Shovon Ashraf
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies
Nabil Shovon Ashraf
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2016. gada 16. februāris |
| ISBN13 | 9783031008993 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 72 |
| Izmēri | 150 × 220 × 10 mm · 176 g |
| Valoda | Angļu |
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