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Die-stacking Architecture - Synthesis Lectures on Computer Architecture Yuan Xie
Die-stacking Architecture - Synthesis Lectures on Computer Architecture
Yuan Xie
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2015. gada 10. jūnijs |
| ISBN13 | 9783031006197 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 113 |
| Izmēri | 150 × 220 × 10 mm · 231 g |
| Valoda | Angļu |
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