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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization Lennart Bamberg 2022 edition
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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Lennart Bamberg
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
395 pages, 100 Illustrations, color; 2 Illustrations, black and white; XXV, 395 p. 102 illus., 100 i
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2022. gada 28. jūnijs |
| ISBN13 | 9783030982287 |
| Izdevēji | Springer Nature Switzerland AG |
| Lapas | 395 |
| Izmēri | 150 × 220 × 20 mm · 766 g |
| Valoda | Vācu |
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