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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok Softcover Reprint of the Original 1st 2018 edition
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2019. gada 5. janvāris |
| ISBN13 | 9783030085612 |
| Izdevēji | Springer Nature Switzerland AG |
| Lapas | 115 |
| Izmēri | 150 × 220 × 10 mm · 185 g |
| Valoda | Vācu |
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