Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - E Zschech - Grāmatas - Springer London Ltd - 9781852339418 - 2005. gada 1. septembris
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes 2005 edition

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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


508 pages, 72 black & white tables, biography

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2005. gada 1. septembris
ISBN13 9781852339418
Izdevēji Springer London Ltd
Lapas 508
Izmēri 155 × 235 × 28 mm   ·   916 g
Valoda Angļu  
Redaktors Mikolajick, Thomas
Redaktors Whelan, Caroline
Redaktors Zschech, Ehrenfried

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