Pastāsti draugiem par šo preci:
Multilayer Ceramic Substrate - Technology for VLSI Package / Multichip Module: Ceramic research and development in Japan K. Otsuka 1993 edition
Multilayer Ceramic Substrate - Technology for VLSI Package / Multichip Module: Ceramic research and development in Japan
K. Otsuka
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
242 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1993. gada 30. aprīlis |
| ISBN13 | 9781851665792 |
| Izdevēji | Kluwer Academic Publishers Group |
| Lapas | 242 |
| Izmēri | 178 × 254 × 16 mm · 539 g |
| Valoda | Angļu |