Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - Ehrenfried Zschech - Grāmatas - Springer London Ltd - 9781849969673 - 2010. gada 22. oktobris
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition

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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


508 pages, 72 black & white tables, biography

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2010. gada 22. oktobris
ISBN13 9781849969673
Izdevēji Springer London Ltd
Lapas 508
Izmēri 155 × 235 × 27 mm   ·   734 g
Valoda Angļu  
Redaktors Mikolajick, Thomas
Redaktors Whelan, Caroline
Redaktors Zschech, Ehrenfried

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