Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices - Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA) - Grāmatas - Institution of Engineering and Technolog - 9781849199346 - 2015. gada 1. decembris
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Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA)
Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices

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This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

304 pages

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2015. gada 1. decembris
ISBN13 9781849199346
Izdevēji Institution of Engineering and Technolog
Lapas 264
Izmēri 245 × 165 × 20 mm   ·   589 g

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