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Silver Metallization: Stability and Reliability - Engineering Materials and Processes Daniel Adams 2008 edition
Silver Metallization: Stability and Reliability - Engineering Materials and Processes
Daniel Adams
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits.
123 pages, 1, black & white illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2007. gada 19. oktobris |
| ISBN13 | 9781848000261 |
| Izdevēji | Springer London Ltd |
| Lapas | 123 |
| Izmēri | 155 × 235 × 9 mm · 317 g |
| Valoda | Angļu |