Silver Metallization: Stability and Reliability - Engineering Materials and Processes - Daniel Adams - Grāmatas - Springer London Ltd - 9781848000261 - 2007. gada 19. oktobris
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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition

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Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits.


123 pages, 1, black & white illustrations

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2007. gada 19. oktobris
ISBN13 9781848000261
Izdevēji Springer London Ltd
Lapas 123
Izmēri 155 × 235 × 9 mm   ·   317 g
Valoda Angļu  

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