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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
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Paredzamā piegāde . gada 11. - 25. sept.
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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices
Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2025. gada 1. jūlijs |
| ISBN13 | 9781837241408 |
| Izdevēji | Institution of Engineering and Technolog |
| Lapas | 199 |
| Izmēri | 150 × 220 × 20 mm · 462 g |
