Pastāsti draugiem par šo preci:
ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis ASM International
ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
461 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2022. gada 30. jūlijs |
| ISBN13 | 9781627084192 |
| Izdevēji | A S M International |
| Lapas | 461 |
| Izmēri | 286 × 231 × 31 mm · 1,15 kg |