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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation Lei He
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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation
Lei He
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
94 pages
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2011. gada 30. jūnijs |
| ISBN13 | 9781601984586 |
| Izdevēji | now publishers Inc |
| Lapas | 94 |
| Izmēri | 156 × 234 × 5 mm · 145 g |
| Valoda | Angļu |
