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Advances in Joining of Ceramics - Ceramic Transactions Series CA Lewinsohn
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Advances in Joining of Ceramics - Ceramic Transactions Series
CA Lewinsohn
Joining remains an enabling technology in several key areas related to the use of ceramics. Development of ceramic materials for electronic, biomedical, power generation, and many other fields continues at a rapid pace. Joining of ceramics is a critical issue in the integration of ceramic components in engineering design.
Marc Notes: Incl. bibl. ref. and index; Conf. papers 2002. Table of Contents: Designing Joints in Ceramics. Selection and Function of Interlayer Materials in Ceramic/Ceramic Joining (E. D. Case). Numerical Modeling of Solid State Bonding Based on Fundamental BondingMechanisms: For Bonding between Dissimilar Materials (Y. Takahashi) Designing Joints with Graded Layers (J. Stamille, I. E. Reimanis, and J. Chapa-Cabrera). Engineering High-Quality Ceramic-Metal Bonds (V. A. Greenhut and T. R. Chapman). Brazing. Particulate Loading of High Temperature Brazes for Joining Engineering Ceramics (K. M. Knowles, D. R. Ormston, D. B. Conquest, L. T. Ecclestone, and J. A. Fernie). Development of a Copper Oxide-Silver Braze for Ceramic Joining (K. S. Weil and J. Y. Kim). Biomedical Applications. A Review of Recent Investigations on Zirconia Joining for Biomedical Applications (S. Agathopoulos, S. Pina, and R. N. Correia). Joining Zirconia and Alumina Bioceramics (H. W. Shin, E. D. Case, B. D. Brooks, P. Kwon, and C. K. Kok). Graded Coatings for Metallic Implant Alloy (E. Saiz, A. P. Tomsia, S. Fujino, and J. M. Gomez-Vaga). High Temperature Applications. Thermal Cycling of Advanced Compressive Seal for Solid Oxide Fuel Cells (Y.-S. Chou and J. W. Stevenson). Brazing a Mixed Ionic/Electronic Conductor to an Oxidation Resistant Metal (K. S. Weil and J. S. Hardy). Brazeless Approaches to Joining Silicon Carbide-based Ceramics for HighTemperature Applications (C. A. Lewinsohn, C. H. Henager Jr., and M. Singh). Processing Issues in Fabricating Ceramic Micro-Heat Exchangers byJoining Components (P. Kwon, C. K. Kok, D. Fickes, C. W. Somerton, H. W. Shin, and E. D. Case).
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2003. gada 7. februāris |
| Oriģinālā izdošanas datums | 2006 |
| ISBN13 | 9781574981537 |
| Izdevēji | John Wiley & Sons Inc |
| Lapas | 232 |
| Izmēri | 156 × 234 × 17 mm · 503 g |
| Redaktors | Lewinsohn, Charles A. (Ceramatec, Inc.) |
| Redaktors | Loehman, Ronald (Sandia National Laboratory) |
| Redaktors | Singh, Mrityunjay (NASA Glenn Research Center) |
